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BondLib 2.1
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Full Spice implementation, 1D mechanical library, heat transfer library
Available downloads
For additional information about this project, please visit the
project page.
Release Notes
Sensor models: The Dp and Dq
models were enhanced by the possibility of specifying non-zero initial
conditions.
Electrical analog library: The internal variables
and models of wrapped models were protected to make them invisible
from the outside. In this way, the models of the standard library and those
of the wrapped bond graph library look much more similar to each other in the
Simulation window, and the simulation doesn't store unnecessarily
internal variables that are of no interest to the modeler. Dymola's
stateSelect algorithm is being used to enforce that the electrical voltages
across capacitors [and the electrical currents through inductors] are being used as
state variables instead of the (internal) effort variables of the underlying bond
graph C elements [and the flow variables of the bond graph I elements].
Electrical analog library: The heat port
and substrate port of the electrical analog library have been enhanced
to allow them to remain unconnected from the outside. An unconnected
heat port corresponds to the assumption of a constant operating
temperature of Tnom. An unconnected substrate port of a bipolar transistor
corresponds to the assumption of an internal connection between the substrate
and either the collector or the emitter, depending on whether the transistor
is laterally or vertically diffused.
Mechanical 1D libraries: Two mechanical
1D libraries for modeling translational and rotational motions were added.
Although these libraries are similar to the corresponding libraries of the
Modelica standard library, their connectors are incompatible due to the
underlying bond graph technology being used. Rather than only transferring
positional and force (torque) information, the connectors of the new
libraries also carry velocity information. Consequently, the models of the
new libraries cannot be mixed with the models of the corresponding libraries
that form part of the Modelica standard library.
HeatTransfer library: A heat transfer library
based on bond graph technology was added. Its connectors are compatible
with the connectors of the corresponding heat transfer library of the Modelica
standard library. Consequently, the models of the new library can be
arbitrarily mixed with the models of the corresponding library that
forms part of the Modelica standard library.
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